What are the performance requirements of the dispensing machine for the bottom filling process?

Automatic dispensing machine is applied in the bottom filling process. What are the requirements for the performance of the automatic dispensing machine?

The bottom filling process involves applying epoxy resin glue to the edge of the flip chip. The glue is sucked to the opposite side of the component to complete the bottom filling process through the "capillary effect", and then the glue is cured under the condition of heating.

What are the performance requirements of the dispensing machine for the bottom filling process?

First, the bottom filling first needs to heat the glue, to maintain the temperature of the glue, so our dispensing machine equipment must have the thermal management function.

Two, the bottom filling process needs to heat the components, which can speed up the capillary flow rate of glue, and provide a favorable guarantee for normal curing.

Three, the bottom filling process on the accuracy of the dispensing requirements are also very high, especially when the RF shield has been assembled in place, the need to dispense through the face.